2024 4th International Conference on Computer, Information Engineering and Electron Materials (CTIEEM 2024)

CTIEEM 2024


Computer Networks & Wireless Communication Databases & Information Systems Engineering & Computer Science (General) Materials Engineering



2024 4th International Conference on Computer, Information Engineering and Electron Materials (CTIEEM 2024) will be held in Zhengzhou, China from November 15th to 17th.



 



Conference Website: https://ais.cn/u/n2uMn2



 



---Call For Papers---



The topics of interest for submission include, but are not limited to:




  1. Computer Technology



· Quantum Computing for Advanced Problem Solving



· Machine Learning in Automated Manufacturing Systems



· Edge and Cloud Computing Integration



· Virtual Reality Systems for Simulation and Training



· Autonomous Systems: Robotics and Drones



......



 




  1. Information Engineering



· Wireless Communication Systems and Network Topologies



· Embedded Systems and Network Security



· Data Mining Techniques in Multimedia Information



· Information Theory and Signal Processing



· Multi-source information fusion technology



......



 




  1. Electronic Materials



· Nanoelectronics and Their Application in Computing



· Materials for High-Performance Semiconductors



· Wearable Electronics and Smart Fabrics



· Photonic Materials for Optoelectronic Devices



· Advanced Dielectric Materials for Capacitors and Transistors



......



 



---Publication---



The CTIEEM 2024 conference has been audited by SPIE-The International Society for Optical Engineering (ISSN : 0277-786X ). After registration, all accepted articles are included in the CTIEEM 2024 conference proceedings, published by EI catalog journals, and retrieved by EI Compendex and Scopus databases.



 



---Important Dates---



Full Paper Submission Date: Octorber 30, 2024



Registration Deadline: November 15, 2024



Final Paper Submission Date: November 11, 2024



Conference Dates: November 15-17, 2024



 



--- Paper Submission---



Please send the full paper(word+pdf) to Submission System:



https://ais.cn/u/n2uMn2