SMEI 2024
Computer Networks & Wireless Communication Artificial Intelligence Microelectronics & Electronic Packaging Real-time & Embedded Systems Robotics
2024 3rd International Conference on Simulation Modeling, Electronic Information Science and Technology (SMEI 2024) will be held on August 02-04, 2024 in Nanjing, China.
Conference Website: https://ais.cn/u/muMzaq
---Call for papers---
The topics of interest for submission include, but are not limited to:
• Modelling and Simulation
• Agent-based Simulation
• Biomedical visualisation and applications
• Bond chart modelling
• Chaos modelling, control and signal transmission
......
• Information Application Development and Integration Technology
• Communication and Information Systems
• Power Electronics
• Robotics
• Embedded Systems
......
---Publication---
All papers submitted to SMEI 2024 will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in the Conference Proceedings, and submitted to EI Compendex, Scopus for indexing.
---Important Dates---
Full Paper Submission Date: June 1, 2024
Notification Deadline:July 09, 2024
Final Paper Submission Date: July 16, 2024
Registration Date: July 23, 2024
Conference Date: August 02-04, 2024
--- Paper Submission---
Please send the full paper(word+pdf) to Submission System:
https://ais.cn/u/muMzaq