International Conference on Image Processing

ICIP 2018


Computer Graphics Computer Vision & Pattern Recognition



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CALL FOR PAPERS
25th IEEE International Conference on Image Processing (ICIP 2018)
Athens, Greece, October 7-10, 2018.
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https://2018.ieeeicip.org/
The 25th IEEE International Conference on Image Processing (ICIP) will be held in the Megaron Athens International Conference Centre, Athens, Greece, on October 7-10, 2018. ICIP is the world's largest and most comprehensive technical conference focused on image and video processing and computer vision. The conference will feature world-class speakers, tutorials, exhibits, and a vision technology showcase.
Topics of interest include, but are not limited to:
* Filtering, Transforms, Multi-Resolution Processing
* Restoration, Enhancement, Super-Resolution
* Computer Vision Algorithms and Technologies
* Compression, Transmission, Storage, Retrieval
* Multi-View, Stereoscopic, and 3D Processing
* Multi-Temporal and Spatio-Temporal Processing
* Biometrics, Forensics, and Content Protection
* Biological and Perceptual-based Processing
* Medical Image and Video Analysis
* Document and Synthetic Visual Processing
* Color and Multispectral Processing
* Scanning, Display, and Printing
* Applications to various fields
* Computational Imaging
* Video Processing and Analytics
* Visual Quality Assessment
* Deep learning for Images and Video
* Image and Video Analysis for the Web
* Image Processing for VR Systems
* Image Procesing for Autonomous Vehicles
-Paper Submission
Authors are invited to submit papers of not more than four pages for technical content including figures and references, with one optional page containing only references. Submission Instructions, templates for the required paper format, and information on "no show" policy are available at 2018.ieeeicip.org.
-Journal Paper Presentations
Authors of papers published in all IEEE Signal Processing Society fully owned journals as well as in IEEE Wireless Communication Letters will be given the opportunity to present their work at ICIP 2018, subject to space availability and approval by the Technical Program Chairs of IEEE ICIP 2018.
-Innovation Program
Following the tradition that started in 2016, the ICIP 2018 Innovation Program Chairs will arrange an outstanding event with prominent speakers from the Industry.
-Tutorials, Special Sessions, and Challenge Sessions Proposals
Tutorials will be held on October 7, 2018. Tutorial proposals must include title, outline, contact information, biography and selected publications for the presenter(s), and a description of the tutorial and material to be distributed to participants. For detailed submission guidelines, please refer to the tutorial proposals page. Special Sessions and Challenge Session Proposals must include a topical title, rationale, session outline, contact information, and a list of invited papers/participants. For detailed submission guidelines, please refer the ICIP 2018 website at 2018.ieeeicip.org.
-Important Dates
* Special Session Proposals: November 15, 2017
* Notification of Special Session Acceptance: December 15, 2017
* Tutorial Proposals: December 15, 2017
* Notification of Tutorial Acceptance: January 15, 2018
* Paper Submission: February 7, 2018
* Notification of Acceptance: April 30, 2018
* Camera-Ready Papers: May 31, 2018
-Conference Website
https://2018.ieeeicip.org/
Organizing Committee
General Chairs
Christophoros Nikou, University of Ioannina, Greece
Kostas Plataniotis, University of Toronto, Canada
Technical Program Chairs
Nikolaos Boulgouris, Brunel University London, UK
Lisimachos P. Kondi, University of Ioannina, Greece
Finance Chair
Aggelos Pikrakis, University of Piraeus, Greece
Plenary Chairs
John Apostolopoulos, Cisco Systems, USA
Athanassios Skodras, University of Patras, Greece
Tutorial Chairs
Christine Guillemot, INRIA, Rennes, France
Rafael Molina, University of Granada, Spain
Special Sessions Chairs
Guy CĂ©, Apple Inc., USA
Adriana Dumitras, Microsoft, USA
Awards Chair
Jean-Philippe Thiran, EPFL, Switzerland
Exhibits/Demo Chair
Adrian Bors, University of York, UK
Publication Chair
Jean-Luc Dugelay, EURECOM, France
Industry Liaison Chairs
Panos Nasiopoulos, University of British Columbia, Canada
Amir Said, Qualcomm, USA
Local Arrangement Chair
Stefanos Kollias, National Technical University of Athens, Greece
Publicity Chairs
Nikos Nikolaidis, Aristotle University of Thessaloniki, Greece
Konstantinos Papadias, Athens Information Technology, Greece
Students/Young Professionals Activities and Doctoral Consortium Chairs
Patrizio Campisi, UniversitĂ  degli Studi Roma Tre, Italy
Sotiris Tsaftaris, University of Edinburgh, UK
Nikolaos Thomos, University of Essex, UK
Registration Chair
Kostas Berberidis, University of Patras, Greece
IEEE Student Activities Chair
Kostas Karpouzis, National Technical University of Athens, Greece
Innovation Program Chairs
Jill Boyce, Intel Corporation
Haohong Wang, TCL Research America
International Liaisons
Panos Papamichalis, Southern Methodist University, USA
Xiao Ping Zhang, Ryerson University, Canada
Yong Man Ro, KAIST, Republic of Korea
Advisory Board
Aggelos Katsaggelos
Petros Maragos
Ioannis Pitas
Sergios Theodoridis