2018 2nd International Conference on Design Engineering and Product Innovation (ICDEPI 2018)
ICDEPI 2018
- URL: http://www.icdepi.org/
- Event Date: 2018-06-01 ~ 2018-06-03
- Submission Date: 2018-01-15
- Location: Dalian, China
2018 2nd International Conference on Design Engineering and Product Innovation (ICDEPI 2018)
June. 1-3, 2018 ｜Dalian, China
http://www.icdepi.org/
2018 2nd International Conference on Design Engineering and Product Innovation (ICDEPI 2018) is co-organized by Dalian University of Technology, Nazarbayev University and Hong Kong Society of Mechanical Engineers (HKSME). The conference will be held at Dalian, China from June 1-3, 2018!
The conference is an international forum for the presentation of technological advances and research results in the fields of Design Engineering and Product Innovation.
●Publication and Indexing
1. Publishing in the Conference Proceeding.
All papers of ICDEPI 2018 will be published in the conference proceeding, which will be indexed by SCOPUS, Ei Compendex and other academic databases.
*All registered and presented will be online publishing
2.Publishing in International Journals.
Selected excellent papers with extension will be recommended to be published in the jounral.
●2017Speakers:
Prof. Cees de Bont：Affiliation: Hong Kong Polytechnic University, Hong Kong
Prof. Henri Christiaans
Chair Professor, Dean of School of Design & Human Engineering, Ulsan National Institute of Science & Technology ,Korea
3.Prof. JanCarel Diehl ,Design for Sustainability ,Delft University of Technology ,Netherlands
4.Prof. José Rui Marcelino ,Design Manager ,Almadesign Company Portugal
●Topics of interest for submission include, but are not limited to:
Design Engineering
Design Processes
Design Theory and Research Methodology
Design Organization and Management
Product, Service and Systems Design
Design Information and Knowledge
Production Innovation
Product Development and Design
Product Process Design and Management
Product Quality Management
Intelligent Product
More topics can be found at: http://www.icdepi.org/cfp.html
●Paper Submission
1.You can choose to submit your paper directly to icdepi@smehk.org
2.You can submit your full paper through electronic submission system: https://cmt3.research.microsoft.com/ICDEPI2018
●Contact Us:
If you have any question, please feel free to contact our conference secretary.
Ms. Suzy Shih
Tel:+852-30697937
Welcome you to contact us by Email to icdepi@smehk.org
http://www.icdepi.org/
June. 1-3, 2018 ｜Dalian, China
http://www.icdepi.org/
2018 2nd International Conference on Design Engineering and Product Innovation (ICDEPI 2018) is co-organized by Dalian University of Technology, Nazarbayev University and Hong Kong Society of Mechanical Engineers (HKSME). The conference will be held at Dalian, China from June 1-3, 2018!
The conference is an international forum for the presentation of technological advances and research results in the fields of Design Engineering and Product Innovation.
●Publication and Indexing
1. Publishing in the Conference Proceeding.
All papers of ICDEPI 2018 will be published in the conference proceeding, which will be indexed by SCOPUS, Ei Compendex and other academic databases.
*All registered and presented will be online publishing
2.Publishing in International Journals.
Selected excellent papers with extension will be recommended to be published in the jounral.
●2017Speakers:
Prof. Cees de Bont：Affiliation: Hong Kong Polytechnic University, Hong Kong
Prof. Henri Christiaans
Chair Professor, Dean of School of Design & Human Engineering, Ulsan National Institute of Science & Technology ,Korea
3.Prof. JanCarel Diehl ,Design for Sustainability ,Delft University of Technology ,Netherlands
4.Prof. José Rui Marcelino ,Design Manager ,Almadesign Company Portugal
●Topics of interest for submission include, but are not limited to:
Design Engineering
Design Processes
Design Theory and Research Methodology
Design Organization and Management
Product, Service and Systems Design
Design Information and Knowledge
Production Innovation
Product Development and Design
Product Process Design and Management
Product Quality Management
Intelligent Product
More topics can be found at: http://www.icdepi.org/cfp.html
●Paper Submission
1.You can choose to submit your paper directly to icdepi@smehk.org
2.You can submit your full paper through electronic submission system: https://cmt3.research.microsoft.com/ICDEPI2018
●Contact Us:
If you have any question, please feel free to contact our conference secretary.
Ms. Suzy Shih
Tel:+852-30697937
Welcome you to contact us by Email to icdepi@smehk.org
http://www.icdepi.org/
Journal Promotion
|
| Acta Koreana (Acta Koreana) |
|
| Acta Via Serica (AVS) |
|
| Computers and Concrete (CAC) |
|
| Journal of Information Processing Systems (JIPS) |
|
| Journal of Internet Computing and Services (KSII - JICS) |
|
| Journal of Smart Tourism (Smart Tourism) |
|
| Membrane and Water Treatment (MWT) |
|
| Wind and Structures, An International Journal (Wind and Structures) |
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