2024 International Symposium on Integrated Circuit Design and Integrated Systems
ICDIS2024
- URL: http://www.icdisconf.com/
- Event Date: 2024-11-22 ~ 2024-11-24
- Submission Date: 2024-08-31
- Organizer: University of Campinas
- Location: Amoy [Xiamen], China
Microelectronics & Electronic Packaging
About
2024 International Symposium on Integrated Circuit Design and Integrated Systems (ICDIS2024) will be held in Xiamen, China during November 22-24, 2024.
The conference will provide a platform for all industry insiders and scholars from all over the world, where researchers, engineers and students from industry, universities and government institutions will present their latest work and discuss many applications of Integrated circuit design and integrated systems. Looking forward to seeing you in Xiamen, China!
CFP
ICDIS2024 invites the submission of original research papers in the fields of theoretical, experimental, and applied cyber security and information engineering to be published in the conference proceedings. Each submission is anonymously reviewed by an average of three independent reviewers, to ensure the final high standard and quality of submitted papers. Accepted papers will be presented as either oral or poster at the conference. Contributions are sought in the following areas:
Analog, Digital, Mixed, and RF Circuits Design
Low Power Tools and Designs Techniques
Sequential Logic Circuit Design
Design of CMOS Combinatorial Logic Gate CMOS
Memory and Array Structure Design
VLSI Design
Silicon / Germanium Devices and Device Physics
Modeling and Simulation of Organic Semiconductor Devices
Test, Fault Tolerance, Reliability and Modelling
Interconnect, Low K, High K and Other Process Technologies
Integrated Circuits CAD, DFM
Signal De-Noise and Processing and Optimization
Highly Integrated Front-End Circuits and Devices
Integrated Circuits for Communications
Physical Design of Integrated Circuits and Systems
Devices and Circuits for Wireless Systems
Devices, Hardware and Methods for Bio-Inspired and Neuromorphic Computing
Manufacturing, Processing, Packaging and Testing Technology of Integrated Circuits and Devices
Electronic Design Automation (EDA)
Data Path in Digital Processor Architecture
Embedded / Multiprocessor Systems
Hardware-Software Co-Design and Co-Verification
Important Dates
Last date for paper submission: August 31, 2024
Last date for paper acceptance: September 30, 2024
Last date for registration: November 15, 2024
Publication
All accepted and registered papers will be included in International Conference Proceedings, which will be published by ACM, and sent to EI Compendex and Scopus for indexing.
Submission Guidelines
-All submissions must be in English with a varying length from 4 to 8 pages including figures and references, adhere to the template format in the conference website, and must be sent to the email: icdis@acamail.org
-Authors must complete their submissions before the designated deadlines. Late submissions will not be considered. The initial and final submissions must be in editable format. Hardcopy is not accepted.
Journal Promotion
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| Acta Koreana (Acta Koreana) |
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| Acta Via Serica (AVS) |
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| Journal of Information Processing Systems (JIPS) |
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| Journal of Internet Computing and Services (KSII - JICS) |
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| Journal of Smart Tourism (Smart Tourism) |
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| Membrane and Water Treatment (MWT) |
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| Wind and Structures, An International Journal (Wind and Structures) |
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