2024 3rd International Conference on Simulation Modeling, Electronic Information Science and Technology (SMEI 2024)

SMEI 2024


Computer Networks & Wireless Communication Artificial Intelligence Microelectronics & Electronic Packaging Real-time & Embedded Systems Robotics



2024 3rd International Conference on Simulation Modeling, Electronic Information Science and Technology (SMEI 2024) will be held on August 02-04, 2024 in Nanjing, China.



 



Conference Website: https://ais.cn/u/muMzaq



 



---Call for papers---



The topics of interest for submission include, but are not limited to:




  1. Simulation Modeling



•   Modelling and Simulation



•   Agent-based Simulation



•   Biomedical visualisation and applications



•   Bond chart modelling



•   Chaos modelling, control and signal transmission



......



 




  1. Electronic Information Science and Technology



•   Information Application Development and Integration Technology



•   Communication and Information Systems



•   Power Electronics



•   Robotics



•   Embedded Systems



......



 



---Publication---



All papers submitted to SMEI 2024 will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in the Conference Proceedings, and submitted to EI Compendex, Scopus for indexing.



 



---Important Dates---



Full Paper Submission Date: June 1, 2024



Notification Deadline:July 09, 2024



Final Paper Submission Date: July 16, 2024



Registration Date: July 23, 2024



Conference Date: August 02-04, 2024



 



--- Paper Submission---



Please send the full paper(word+pdf) to Submission System:



https://ais.cn/u/muMzaq