2025 International Conference on Materials, Mechanical, and Civil Engineering Technologies
MMCET 2025
- URL: https://mmcet.com/
- Event Date: 2025-12-17 ~ 2025-12-19
- Abstract Submission Date: 2025-12-30
- Submission Date: 2025-07-30
- Organizer: Tokyo International University
- Location: Tokyo, Japan
Materials Engineering Nanotechnology Chemical & Material Sciences (General) Composite Materials Architecture Automation & Control Theory Mechanical Engineering Transportation Civil Engineering
Full name: 2025 International Conference on Materials, Mechanical, and Civil Engineering Technologies
Abbreviation: MMCET 2025
Website: www.mmcet.com
Date: 17th-19th, 2025
Location: Tokyo, Japan
MMCET 2025 will be held in Tokyo, Japan from December 17th-19th, 2025. MMCET 2025 is sponsored by Tokyo Denki University, University of Electronic Science and Technology of China, National Pingtung University of Science and Technology, American Society for Electrical Engineering and Universiti Teknologi Malaysia, and the aim of this conference is to bring together researchers and developers from both academia and industry to report on the latest scientific and theoretical advances, to discuss and debate major issues and to demonstrate state-of-the-art systems.
*PUBLICATION
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Accepted full papers will be published in one of the following journals depending on the topic of your paper, and submitted for SCI/SCOPUS/Ei Compendex index.
(1) Journal of Nano Research (JNanoR)
Indexed in: SCIE, SCOPUS, EI Compendex
ISSN print 1662-5250, ISSN cd 1661-9889, ISSN web 1661-9897
(2) Journal of Biomimetics, Biomaterials and Biomedical Engineering (JBBBE)
Indexed in: ESCI, SCOPUS, EI Compendex
ISSN print 2296-9837 ISSN cd 2296-9853 ISSN web 2296-9845
(3) Key Engineering Materials (KEM)
Indexed in: SCOPUS, Inspec, REAXYS
ISSN print 1013-9826 ISSN cd 1662-9809 ISSN web 1662-9795
(4) Materials Science Forum (MSF)
Indexed in: SCOPUS, Inspec, REAXYS
ISSN print 0255-5476 ISSN cd 1662-9760 ISSN web 1662-9752
(5) Solid State Phenomena (SSP)
Indexed in: SCOPUS, Inspec, REAXYS
ISSN print 1012-0394 ISSN cd 1662-9787 ISSN web 1662-9779
(6) Nano Hybrids and Composites (NHC)
Indexed in: ESCI, Inspec, CAS
ISSN print 2297-3370 ISSN cd 2297-3419 ISSN web 2297-3400
(7) Advances in Science and Technology (AST)
Indexed in: SCOPUS, Google Scholar
ISSN print 1662-8969 ISSN cd 1661-819X ISSN web 1662-0356
(8) Defect and Diffusion Forum (DDF)
Indexed in: SCOPUS, EI Compendex, Inspec
ISSN print 1012-0386 ISSN cd 1662-9515 ISSN web 1662-9507
*TOPICS
We target contributions from both academia and industrials on the following topics, but not limited to:
▪Materials Engineering
Nanomaterials
Composite Materials
Biomaterials
Corrosion Resistance
Additive Manufacturing
Polymer Degradation
Metal Fatigue
Smart Materials
Surface Treatments
Thermal Properties of Materials
▪Mechanical Engineering
Thermodynamic
Fluid Dynamics
Dynamics of Machinery
Mechanical Vibrations
Heat Exchangers
Renewable Energy Systems
CAD/CAM Technologies
Gear Design and Analysis
Robotics and Automation
Manufacturing Processes
▪Civil Engineering
Structural Engineering
Geotechnical Analysis
Transportation Planning
Water Resource Management
Environmental Impact Assessment
Construction Techniques
Urban Infrastructure Development
Pavement Engineering
Seismic Design
Sustainable Construction Practices
*MMCET 2025 AWARDS
▪Best Paper Award
▪Best Oral Presentation Award
▪Best Poster Presentation Award
▪Best Reviewer Award
*SUBMISSION
1. Full Paper (Publication and Presentation)
2. Abstract (Presentation only)
Submission link: https://easychair.org/conferences/?conf=mmcet2025
*IMPORTANT DATES
▪Submission Deadline
July 30, 2025
▪Notification Date
August 30, 2025
▪Registration Deadline
September 20, 2025
*ORGANIZING COMMITTEE
▪Conference Chairs
Hisaki Watari, Tokyo Denki University, Japan
Kazuo Umemura, Tokyo University of Science, Japan
▪Program Chairs
Yao Yan, University of Electronic Science and Technology of China, China
John Chia-Yen Lee, National Pingtung University of Science and Technology, Taiwan
Farid Abed, American University of Sharjah, United Arab Emirates
▪Program Co-chairs
Payam Shafigh, Wenzhou University of Technology, China
Elammaran Jayamani, Swinburne University of Technology Sarawak Campus, Malaysia
▪Publicity Chairs
Mohamed Hussien, Universiti Teknologi Malaysia, Malaysia
Li-Tsung Sheng, National Ilan University, Taiwan
*VENUE
Tokyo University of Science, Japan
Kagurazaka campus, Building #13--Morito Memorial Hall
Address: 4-chōme-4-4 Kagurazaka, Shinjuku City, Tōkyō-to 162-0825
*CONTACT
mmcet_conf@163.com
website: www.mmcet.com
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