9th International Conference on Mechanical Engineering (ME 2024)

ME 2024

URL: https://cirsy2024.org/me/index
Event Date: 2024-04-27 ~ 2024-04-28
Abstract Submission Date: 2024-04-13
Submission Date: 2024-04-13
Location: Copenhagen, Denmark

Mechanical Engineering

9th International Conference on Mechanical Engineering (ME 2024)

April 27 ~ 28, 2024, Copenhagen, Denmark

https://cirsy2024.org/me/index

Call for Papers

9th International Conference on Mechanical Engineering (ME 2024) will provide an excellent international forum for sharing knowledge and results in theory, methodology and applications impacts and challenges of Mechanical Engineering. The conference documents practical and theoretical results which make a fundamental contribution for the development of Mechanical Engineering. The aim of the conference is to provide a platform to the researchers and practitioners from both academia as well as industry to meet and share cutting-edge development in the field.

Topics of interest include, but are not limited to, the following:

Advances Aero Space Technology

Artificial Intelligence and Expert Systems

CAD/CAM, Automation & Robotics

Design Tools, Cutting Tool Material and Coatings

Energy Conservation, Renewable Energy Techniques

Fluid Dynamics, Bio-fuels and Fuel Cells

Logistics and Supply Chain Management

Machinability of Materials, Composite Materials

Non-Traditional Machining processes

Operations Management

Reliability and Maintenance Engineering

Total Quality Management and Quality Engineering

Transportation Systems

Tribology

Paper Submission

Authors are invited to submit papers through the conference Submission System by April 13 , 2024. Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference. The proceedings of the conference will be published by International Journal of Recent Advances in Mechanical Engineering (IJMECH) (Confirmed).

Selected papers from ME 2024, after further revisions, will be published in the special issue of the following journal.